发明名称 WIRING PROCESSING DEVICE FOR SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To carry out a wiring processing for a semiconductor integrated circuit equal to a skilled person even by an inexperienced designer by effectively using past wiring processing data. SOLUTION: In a CPU 102, a temporary wiring treating of figure data of a wiring treating object stored in a figure data storing part 109 is carried out by using a temporary wiring parameter for a temporary wiring treatment stored in a pre-wiring parameter storing part 108 and selected by an input device 101, and a normal wiring treatment of the figure data is carried out by using a normal wiring parameter associated with wiring processing evaluation result data that is the same as wiring treatment evaluation result data of a wiring rate or the like obtained as a result of the temporary wiring processing of normal wiring parameters stored in an actual wiring parameter storing part 107. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004272498(A) 申请公布日期 2004.09.30
申请号 JP20030060882 申请日期 2003.03.07
申请人 JEDAT INC 发明人 MOCHIZUKI YOSHIHIRO
分类号 G06F17/50;H01L21/82;(IPC1-7):G06F17/50 主分类号 G06F17/50
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