| 摘要 |
PROBLEM TO BE SOLVED: To enhance inspection precision in delivery inspection of a semiconductor device, to shorted an inspection time therein, and to measure both timing specifications for a differential output driver at the same time. SOLUTION: An input pattern is input into an output driver inside the semiconductor device, a P channel or N channel transistor of the output driver is brought into continuity, and an optional voltage is impressed from an outside to measure a current (step S10). An output impedance is computed based on the measured current and the impressed voltage (step S11), timing times in leading and tailing are computed based on the output impedance (steps S12, S13) to compute a ratio of the respective timing times and a cross-over voltage (steps S14, S15), and quality of the semiconductor is determined, based on the respective computed results (step S16). COPYRIGHT: (C)2004,JPO&NCIPI
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