发明名称 MATERIAL FOR MULTILAYER PRINTED CIRCUIT BOARD WITH BUILT-IN CAPACITOR, SUBSTRATE FOR MULTILAYER PRINTED CIRCUIT BOARD, MULTILAYER PRINTED CIRCUIT BOARD AND METHODS FOR PRODUCING THOSE
摘要 <p>A material for a multilayer printed circuit board with built-in capacitor is characterized in that a dielectric thin film having a relative dielectric constant of 10-2,000 and a thickness of 0.05-2 mum is formed on a surface of a metal foil. A substrate for a multilayer printed circuit board, a multilayer printed circuit board, and methods for producing them are also disclosed. By using such a material, a multilayer printed circuit board with built-in capacitor which is excellent in high-density wiring and economical efficiency can be obtained.</p>
申请公布号 WO2004084597(A1) 申请公布日期 2004.09.30
申请号 WO2004JP03729 申请日期 2004.03.19
申请人 HITACHI CHEMICAL CO., LTD.;SHIMADA, YASUSHI;KONDOU, YUUSUKE;MADARAME, KEN;OTSUKA, KAZUHISA;SHIMAYAMA, YUICHI;YAMAGUCHI, MASANORI;MIZUSHIMA, ETSUO;YAMAMOTO, KAZUNORI;TAKANEZAWA, SHIN;KUMASHIRO, YASUSHI;HIRATA, YOSHITAKA;ARATA, MICHITOSHI 发明人 SHIMADA, YASUSHI;KONDOU, YUUSUKE;MADARAME, KEN;OTSUKA, KAZUHISA;SHIMAYAMA, YUICHI;YAMAGUCHI, MASANORI;MIZUSHIMA, ETSUO;YAMAMOTO, KAZUNORI;TAKANEZAWA, SHIN;KUMASHIRO, YASUSHI;HIRATA, YOSHITAKA;ARATA, MICHITOSHI
分类号 H05K1/16;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/16
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