发明名称 A SUBSTRATE STRUCTURE, A METHOD AND AN ARRANGEMENT FOR PRODUCING SUCH SUBSTRATE STRUCTURE
摘要 The present invention relates to a substrate structure comprising at least two substrate layers extending in substantially parallel planes, which substrate layers are (Z-)interconnected in a direction substantially perpendicular to said planes. It comprises at least one adhesive film layer for interconnecting said at least two substrate layers, said adhesive film layer(s) comprising non-conductive portions and conductive portions. The position(s) of conductive portions is controllable such as to admit positioning of conductive portions at locations in the substrate layers where electrical conductivity is needed in a direction substantially perpendicular to the planar extension of, and between, two interconnected substrate layers.
申请公布号 AU2003212761(A1) 申请公布日期 2004.09.30
申请号 AU20030212761 申请日期 2003.03.14
申请人 TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) 发明人 MALIN SJOBERG;KLAS AXELSSON;HAKAN TORNQVIST;SOPHIA JOHANSSON
分类号 H01L23/538;H01L25/065;H05K1/18;H05K3/32;H05K3/46;(IPC1-7):H05K1/11 主分类号 H01L23/538
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