| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a BGA (ball grid array) of high reliability which prevents disconnection and deterioration of step coverage. <P>SOLUTION: A support substrate 15 is adhered to the surface of a semiconductor chip 16, and a pad electrode 12 is formed which extends from the surface of the chip 16 to the support substrate 15. The extending part of the electrode 12 and the rear face of the chip 16 are covered with a photosensitive insulating film 17. A contact hole 18 is formed in the insulating film 17 in which a re-wiring layer 21 is embedded. The re-wiring layer 21 is connected with the electrode 12 through the contact hole 18, and extends on the insulating film 17 over the rear face of the chip 16. A ball shape terminal 22 is formed on the re-wiring layer 21. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
