| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent exertion of influence even when a first semiconductor chip whose calorific value is large and a second semiconductor chip whose calorific value is small are integrally sealed with resin. <P>SOLUTION: This resin sealed semiconductor device is constituted of: the first semiconductor chip 15 in which bonding pads 16, 16 for external electrode drawers are subjected to wire bonding to the respective outer leads 25A, 25A- and whose calorific value is large; and the second semiconductor chip 17 in which bonding pads 18, 18 for external electrode drawers are subjected to wire bonding to the respective outer leads 25B, 25B-, and whose calorific value is smaller than that of the first semiconductor chip. The first semiconductor chip 15 is molded with high thermal conductive resin 28. The second semiconductor chip 17 and the first semiconductor chip 15 molded with the high thermal conductive resin are integrally molded with non-high thermal conductive resin 31. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
