| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To remove a defective product of a semiconductor element by discovering a defect on a thinned resin mold part by a simple method and a device. <P>SOLUTION: A rectifying device 1 for small power or the like having the resin mold part 4 is used as a DUT 10, and a withstand voltage test to the mold thickness from the top part of a loop-shaped bending part 7 of a metal thread 8 existing in the resin mold part 4 to the resin mold part 4 upper face, is performed so as to detect a leak current by applying a prescribed voltage to the interval between T1 terminal connected to a pressure-contact type electrode 14 arranged on the resin mold part 4 upper face and T2 terminal where a first lead terminal 2 and a second lead terminal 3 exposed from both ends of the resin mold part 4 to the outside are connected in the short-circuited state. Thus, determination between a nondefective product and a defective product of the DUT 10 is performed, and the defective product is removed by a removal means. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
