METHOD FOR MANUFACTURING CARRIER TAPE FOR PACKAGING ELECTRONIC COMPONENT AND METHOD FOR CONDITIONING HUMIDITY IN INSULATING FILM

摘要

PROBLEM TO BE SOLVED: To manufacture a carrier tape for packaging electronic components having excellence in dimensions even if using a wide insulating film. SOLUTION: A method for manufacturing the carrier tape for packaging electronic components has a process for forming perforations in a long insulating film after the insulating film is retained for a specified period in a humidity conditioning environment whose humidity and temperature are conditioned to specific ones, for forming the perforations in the insulating film at a specific interval, for providing a conductive metal layer on at least one surface of the insulating film, and for forming a wiring pattern by the conductive metal layer. In the insulating film retained in the humidity conditioning environment, a specific gap is needed to be provided between overlapped insulating films. COPYRIGHT: (C)2004,JPO&NCIPI