发明名称 MEMS SUBSTRATE, MEMS SUBSTRATE FORMING METHOD, AND FLUID DELIVERY ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus for measuring stress inside a MEMS element precisely. SOLUTION: A substrate (20) for a MEMS element in one embodiment includes a base material (40) having a first side (42), a strain gauge (30) comprising a polysilicon material formed on the first side, a dielectric material (52) disposed over the strain gauge, and a conductive material (62) in communication with the strain gauge through the dielectric material. The substrate is so formed as to have at least one opening (26) formed therethrough, and the strain gauge is formed adjacent to the at least one opening. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004271527(A) 申请公布日期 2004.09.30
申请号 JP20040065493 申请日期 2004.03.09
申请人 HEWLETT-PACKARD DEVELOPMENT CO LP 发明人 NIKKEL ERIC LEE
分类号 B41J2/045;B41J2/055;B41J2/14;B41J2/16;B81B1/00;B81B7/02;G01L1/18;G01L1/22;(IPC1-7):G01L1/18 主分类号 B41J2/045
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