发明名称 |
WAFER HOLDER FOR SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE IN WHICH IT IS INSTALLED |
摘要 |
Wafer holder and semiconductor manufacturing equipment in which the holder is installed, the wafer holder having a wafer-carrying surface, wherein incidence of warping and cracking when the wafer holder is heated is slight. In the wafer holder having a wafer-carrying surface, electrical circuitry consisting of one or more sinter laminae is formed on the face or in the interior of the wafer holder; and by rendering pores present in the circuitry, the incidence of warping and cracking can be made very slight. The electrical circuitry is preferably any of an electrode circuit for an electrostatic chuck, a resistive-heating-element circuit, an RF-power electrode circuit, and a high-voltage-generating electrode circuit.
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申请公布号 |
US2004188321(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
US20030604514 |
申请日期 |
2003.07.28 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
NATSUHARA MASUHIRO;NAKATA HIROHIKO;HASHIKURA MANABU |
分类号 |
H05B3/12;H01L21/00;H01L21/02;H01L21/205;H01L21/265;H01L21/3065;H01L21/683;H05B3/74;(IPC1-7):B65D85/00 |
主分类号 |
H05B3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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