| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for appropriately preventing shorting between wires in resin sealing-type electronic equipment where semiconductor elements and a member which is electrically connected to the semiconductor elements through wires are sealed with mold resin. <P>SOLUTION: In the manufacturing method of electronic equipment, a plurality of the semiconductor elements 20 are mounted on a circuit board 10, the circuit board 10, the semiconductor elements 20 and lead frames 40 are electrically connected through the conductive wires 50 and they are sealed to be surrounded by mold resin 60. The method is provided with a first process for electrically connecting the circuit board 10, the semiconductor elements 20, and the lead frames 40 through the wires 50; a second process for applying insulating resin members 70 to surfaces of the wires 50 so as to arrange them; and a third process for sealing the circuit board 10, the semiconductor elements 20, the lead frames 40, and the wires 50 at mold resin 60. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
