CURABLE POLYPHENYLENE ETHER BASED COMPOSITE MATERIAL

摘要

PROBLEM TO BE SOLVED: To obtain a curable polyphenylene ether based resin composition having an excellent adhesive strength to a conductor, and also to provide a material for a high density wiring board suitable for high-frequency use and a printed circuit board using the same . SOLUTION: The composition comprises a modified polyphenylene ether, a crosslinking compound and a hydrogenated product of a block copolymer with specifically modified functional groups. The wiring board prepared from the above composition has an excellent adhesion to a conductor, a low dielectric constant and a low dielectric loss. COPYRIGHT: (C)2004,JPO&NCIPI