发明名称 |
High-power, integrated AC switch module with distributed array of hybrid devices |
摘要 |
A novel architecture of high-power four-quadrant hybrid power modules based on high-current trench gate IGBTs and arrays of low-current wide-bandgap diodes is conceived. The distributed physical layout of high power density wide-bandgap devices improves the cooling inside a fully-sealed module case, thus avoiding excessive internal heat flux build up and high PN junction temperature, and benefiting the converter's reliability and efficiency. The design of multiple-in-one hybrid integrated AC-switch module at high power ratings is enabled by using hybrid AC switch cells and aluminum nitride substrate structure.
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申请公布号 |
US2004188706(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
US20030401013 |
申请日期 |
2003.03.27 |
申请人 |
CHANG JIE;JING X.;WANG ANHUA;ZHANG JIAJIA |
发明人 |
CHANG JIE;JING X.;WANG ANHUA;ZHANG JIAJIA |
分类号 |
H01L25/07;H01L25/18;H02M7/00;(IPC1-7):H01L29/74 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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