发明名称 |
Semiconductor device and method for manufacturing the same |
摘要 |
An object of the present invention is to increase adhesiveness between thin films, particularly a high molecular film formed on an insulating surface, and the present invention provides a semiconductor device with high reliability and a method for manufacturing the semiconductor device with high yield. A semiconductor device of the present invention comprises a laminate structure formed in close contact with an organic insulating film on a hydrophobic surface of an inorganic insulating film including silicon and nitrogen. A film having the hydrophobic surface is an insulating film having a contact angle of water of equal to or more than 30°, preferably of equal to or more than 40°.
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申请公布号 |
US2004188688(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
US20040808343 |
申请日期 |
2004.03.25 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
MURANAKA KOJI |
分类号 |
G02F1/1333;G02F1/1343;H01L21/312;H01L21/318;H01L21/77;H01L21/84;H01L27/08;H01L27/12;H01L29/786;(IPC1-7):H01L35/24;H01L29/40 |
主分类号 |
G02F1/1333 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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