| 摘要 |
<P>PROBLEM TO BE SOLVED: To make realizable the prevention of a short circuit due to sagging of a wire loop at a low cost. <P>SOLUTION: In a semiconductor device in which a pad 2a, which is a first bonding point 3 of a semiconductor chip 2 fixed on a lead frame 1, and a second bonding point 4 of a lead 1a of the lead frame 1 are electrically connected by a wire 5, a bump 6 is provided from the second bonding point 4 to the semiconductor chip 2 side by a wire bonding method. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
