| 发明名称 |
ELECTRICALLY CONDUCTIVE PASTE MATERIALS AND APPLICATIONS |
| 摘要 |
<p>A STRUCTURE AND METHOD OF FABRICATION ARE DESCRIBED. THE STRUCTURE (30) IS A COMBINATION OF A POLYMERIC MATERIAL (36) AND PARTICLES (32), E.G. CU, HAYING AN ELECTRICALLY CONDUCTIYE COATING (34), E.G. SN. HEAT IS APPLIED TO FUSE THE COATING OF ADJACENT PARTICLES. THE POLYMERIC MATERIAL IS A THERMOPLASTIC. THE STRUCTURE IS DISPOSED BETWEEN TWO ELECTRICALLY CONDUCTIYE SURFACES (40, 42), E.G. CHIP AND SUBSTRATE PADS, TO PROYIDE ELECTRICAL INTERCONNECTION AND ADHESION BETWEEN THEIR PADS. (FIGURE 3)</p> |
| 申请公布号 |
MY118121(A) |
申请公布日期 |
2004.09.30 |
| 申请号 |
MY1995PI02913 |
申请日期 |
1995.09.29 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SUNG K. KANG;TERESITA O GRAHAM;SAMPATH PURUSHOTHAMAN;JUDITH MARIE ROLDAN;RAVI F SARAF |
| 分类号 |
C08K9/02;H05K3/32;B22F1/00;B22F1/02;B22F7/08;C08L101/00;C09D5/24;C09J9/02;C09J11/00;C09J11/02;C09J11/04;C09J101/02;C09J183/08;C09J191/00;C09J197/00;C09J201/00;C23C24/08;H01B1/00;H01B1/22;H01L21/60;H01L23/498;H01R4/04;H05K1/18 |
主分类号 |
C08K9/02 |
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