发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit having a power supply wiring structure for effectively reducing a voltage drop across a power supply wire in a partial region in a chip. SOLUTION: The semiconductor integrated circuit includes first mesh power wires for supplying a prescribed power supply to a first region, and second mesh power wires for supplying the same power supply as the prescribed power supply to a second region different from the first region. The first mesh power wires and the second mesh wires are separated at a border between the first region and the second region. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004273844(A) 申请公布日期 2004.09.30
申请号 JP20030063843 申请日期 2003.03.10
申请人 FUJITSU LTD 发明人 USHIYAMA KENICHI
分类号 H01L21/822;H01L21/82;H01L27/02;H01L27/04;H01L27/092;(IPC1-7):H01L21/822 主分类号 H01L21/822
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