| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for joining a wiring electrode between substrates so that electric continuity is stably maintained and a structure where such joining is performed. SOLUTION: As for the method and structure for joining the wiring electrode between substrates, an insulating film 3 which is different in coefficient of linear expansion from one substrate 1 is formed on one surface of the substrate 1, and a wire 10 and an electrode 13 are provided on the insulating film 3. On both surfaces of the other substrate 2, insulating films 6 and 8 which are different in coefficients of linear expansion from that of the substrate 2 are formed and on the insulating film 8 on one surface of the substrate 2, a wire 11 and an electrode 12 are provided; and both the substrates 1 and 2 are put opposite each other to join the corresponding electrodes 12 and 13 of both the substrates 1 and 2 together. COPYRIGHT: (C)2004,JPO&NCIPI
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