| 摘要 |
PROBLEM TO BE SOLVED: To provide a double connected type longitudinally coupled DMS filter apparatus of a wafer level CSP structure whereby external terminals can be located at desired positions. SOLUTION: The surface acoustic wave device includes: a surface acoustic wave element wherein a vibration propagation section and pad electrodes electrically connected to part of the vibration propagation section are formed on one principal side of a piezoelectric substrate; a first insulation film formed to cover the vibration propagation section and a region other than part of the pad electrodes on the principal side of the surface acoustic wave element; a second insulation film formed to cover the vibration propagation section and an upper side of the first insulation film formed at the circumferential edge of the vibration propagation section at a prescribed interval from the vibration propagation section; rewiring lead electrodes conductive to part of the pad electrodes and extended at least up to the upper side of the first insulation film; a pole electrode electrically connected to the rewiring lead electrodes on the first insulation film; and a sealing member for covering the first and second insulation films and the rewiring lead electrodes and formed to expose an upper end of the pole electrode. COPYRIGHT: (C)2004,JPO&NCIPI
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