| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for inspecting circuit board for surely inspecting the packaged state of chip components, such as a bypass capacitor, simply by bringing a probe into contact with the chip components, without using expensive facilities, such as image processing. SOLUTION: The circuit board inspecting device comprises a first probe 100, having an inclination surface 101 in contact with the upper end of the lead electrode of the chip component 1, and a second probe 200 made of a normal probe pin. The inclination surface 101 of the first probe 100 is brought into contact with the upper end at the side of, for example, a lead electrode 3 of the chip component 1; the second probe 200 is brought into contact with a wiring pattern 5, where the lead electrode 3 is connected; short-circuiting/open-circuiting between the probes 100, 200 is inspected by a measurement section 300; and the presence or the absence of the chip component 1 is decided. COPYRIGHT: (C)2004,JPO&NCIPI
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