发明名称 |
SENSOR ASSEMBLY AND METHODS OF MAKING AND USING SAME |
摘要 |
A sensor assembly for sensors such as microfabricated resonant sensors is disclosed. The disclosed assembly provides improved performance of the sensors by providing a thermally insensitive environment and short pathways for signals to travel to processing components. Further, the assembly provide modular construction for the sensors and housing modules, thereby allowing replacement of the sensors at a lower cost. The assembly includes a sensor module including a sensor formed on a conductive substrate with a cavity formed on one surface. The substrate has conductive vias extending from the cavity to a second surface of the substrate. A housing assembly accommodates the sensor and includes a rigid housing, preferably made from a ceramic. An electronic component, such as an amplifier, is mounted on the rigid housing. The electronic component electrically engages the vias substantially at the second surface of the substrate. The electronic component receive signals from the sensor through the vias. The signals are then processed through an amplifier and a digital signal processor using a modified periodogram. |
申请公布号 |
WO2004082363(A2) |
申请公布日期 |
2004.09.30 |
申请号 |
WO2004US08291 |
申请日期 |
2004.03.17 |
申请人 |
NERENBERG MICHAEL;RICHEY JAMES S;NEBRIGIC DRAGAN;LEE JASON;LECLAIR TIM;BELLEW COLBY;COLLINS BOYCE E;LIU KELVIN |
发明人 |
NERENBERG MICHAEL;RICHEY JAMES S;NEBRIGIC DRAGAN;LEE JASON;LECLAIR TIM;BELLEW COLBY;COLLINS BOYCE E;LIU KELVIN |
分类号 |
B81B7/00;G01L9/00;G01N33/553 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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