发明名称 |
Component used for electronic circuits has spacer elements arranged between a frame part and a covering part to define a gap provided with an adhesive layer to bind the frame part to the covering part |
摘要 |
<p>Component (10) comprises frame (14) and a covering parts (16) both made from materials having different heat expansion coefficients. Spacer elements (34) are arranged between frame part and covering part to define gap. A layer made from adhesive (40) is provided in gap to bind frame part to covering part and seal the gap at the same time. An independent claim is also included for a process for the production of a component.</p> |
申请公布号 |
DE10313835(A1) |
申请公布日期 |
2004.09.30 |
申请号 |
DE2003113835 |
申请日期 |
2003.03.21 |
申请人 |
TYCO ELECTRONICS PRETEMA GMBH & CO.KG;SIEMENS AG;ZF FRIEDRICHSHAFEN AG |
发明人 |
BERCHTOLD, LORENZ;KURZEJA, DIETMAR |
分类号 |
B65D53/00;F16B11/00;H05K5/02;H05K5/06;(IPC1-7):H05K5/02 |
主分类号 |
B65D53/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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