SEMICONDUCTOR MODULE AND COOLING DEVICE

摘要

A semiconductor module comprises a substrate (2) on which a plurality of semiconductor elements (1), which may generate heat, are mounted; and a heat radiation plate (3) that covers the substrate (2) and serves as a retainer frame. The heat radiation plate (3) includes a plurality of projecting fins (4). A cover plate (6) is fixed to the heat radiation plate (3) to form a wind tunnel through which cooling air passes. A cooling fan (7) is fixed in the wind tunnel (5).