| 摘要 |
A semiconductor die may include circuitry and a circuit designed to provide protection to the circuitry from an electrostatic discharge coming into the semiconductor die through an input/output pad of the semiconductor die. The circuit may be physically coupled to the input/output pad by a coupling device. When the coupling device is in a first state, the circuit may be electrically coupled to the circuitry and the input/output pad, and when the coupling device is in a second state, the circuit may be electrically decoupled from the circuitry and the input/output pad.
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