METHOD AND DEVICE FOR WETTING A SUBSTRATE WITH A LIQUID

摘要

The invention relates to a method for wetting a substrate with a liquid, said method comprising the following steps: a) a substrate with a surface to be wetted is provided; b) a wetting liquid is provided; c) a protective layer is applied to the substrate, separating the surface to be wetted from the environment; d) the protective layer is structured in order to expose pre-determined wetting areas on the surface of the substrate to be wetted; and e) the wetting liquid is applied to the exposed wetting areas by means of a wetting device without any direct contact between the wetting device and the surface of the substrate to be wetted. The invention also relates to one such mass-produced substrate.