发明名称 |
Arrangement of a layer to be heated on a substrate |
摘要 |
<p>The substrate, e.g. of silicon, has a glass layer (3) applied to part of the top surface of the silicon substrate, with a heating electrode (21) used for heating a selected region (35) of the glass layer. A recess (410) is provided in the substrate surface below the heated region, for thermally isolating the latter from the substrate which has a higher heat conductivity than the glass.</p> |
申请公布号 |
EP0915511(B1) |
申请公布日期 |
2004.09.29 |
申请号 |
EP19980119530 |
申请日期 |
1998.10.15 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
MAERZ, REINHARD, DR.;DIECKROEGER, JENS |
分类号 |
H01L23/34;(IPC1-7):H01L23/34;G02B6/12;G02F1/01;G02F1/313 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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