发明名称 Arrangement of a layer to be heated on a substrate
摘要 <p>The substrate, e.g. of silicon, has a glass layer (3) applied to part of the top surface of the silicon substrate, with a heating electrode (21) used for heating a selected region (35) of the glass layer. A recess (410) is provided in the substrate surface below the heated region, for thermally isolating the latter from the substrate which has a higher heat conductivity than the glass.</p>
申请公布号 EP0915511(B1) 申请公布日期 2004.09.29
申请号 EP19980119530 申请日期 1998.10.15
申请人 INFINEON TECHNOLOGIES AG 发明人 MAERZ, REINHARD, DR.;DIECKROEGER, JENS
分类号 H01L23/34;(IPC1-7):H01L23/34;G02B6/12;G02F1/01;G02F1/313 主分类号 H01L23/34
代理机构 代理人
主权项
地址