发明名称 MOLDED HOUSING WITH INTEGRAL HEATSINK
摘要 <p>A plastic housing assembly is constructed with a non-plateable plastic wall portion (101), and a plateable plastic wall portion (107) positioned abutting (109) the non-plateable plastic wall portion (101). The plateable plastic wall portion (107) has a via (115) disposed therethrough for thermally coupling an outer surface (111) to an inner surface (113). A heat-generating component (119) is disposed coupled to the second inner surface (113). The via (115) is preferably plated with metal so that heat produced from the heat-generating component (119) is conducted away from the inner surface (113) to the outer surface (111).</p>
申请公布号 EP1092339(A4) 申请公布日期 2004.09.29
申请号 EP19990928417 申请日期 1999.06.08
申请人 MOTOROLA, INC. 发明人 CHRISTOPHER, GARY, L.;ROCHOWICZ, WILLIAM, R.
分类号 H01L23/367;H05K1/00;H05K1/02;H05K1/14;H05K3/18;H05K3/34;H05K3/42;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/367
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