发明名称 |
MOLDED HOUSING WITH INTEGRAL HEATSINK |
摘要 |
<p>A plastic housing assembly is constructed with a non-plateable plastic wall portion (101), and a plateable plastic wall portion (107) positioned abutting (109) the non-plateable plastic wall portion (101). The plateable plastic wall portion (107) has a via (115) disposed therethrough for thermally coupling an outer surface (111) to an inner surface (113). A heat-generating component (119) is disposed coupled to the second inner surface (113). The via (115) is preferably plated with metal so that heat produced from the heat-generating component (119) is conducted away from the inner surface (113) to the outer surface (111).</p> |
申请公布号 |
EP1092339(A4) |
申请公布日期 |
2004.09.29 |
申请号 |
EP19990928417 |
申请日期 |
1999.06.08 |
申请人 |
MOTOROLA, INC. |
发明人 |
CHRISTOPHER, GARY, L.;ROCHOWICZ, WILLIAM, R. |
分类号 |
H01L23/367;H05K1/00;H05K1/02;H05K1/14;H05K3/18;H05K3/34;H05K3/42;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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