发明名称 |
Soldering method and apparatus |
摘要 |
<p>A soldering apparatus includes an inspection station I downstream of the soldering station D. A board PCB2 is collected from conveyor A, soldered at station D and returned to conveyor A, while a previously soldered board PCB2 is inspected at station I. If PCB1 board fails inspection at station I, PCB2 is moved from conveyor A to conveyor B, so that PCB1 can be moved back on to conveyor A, for collection and re-soldering at station D. PCB2 can then be moved forwards for inspection at station I.</p> |
申请公布号 |
EP1463390(A2) |
申请公布日期 |
2004.09.29 |
申请号 |
EP20040251826 |
申请日期 |
2004.03.26 |
申请人 |
PILLARHOUSE INTERNATIONAL LIMITED |
发明人 |
CINIGLIO, ALEXANDER JAMES |
分类号 |
H05K1/02;H05K3/22;H05K3/34;H05K13/00;(IPC1-7):H05K3/34;H05K13/08 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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