发明名称 |
COMPOSITE PLATING FILM AND A PROCESS FOR FORMING THE SAME |
摘要 |
A composite nickel and copper alloy plating film ( 3 ) containing nickel and copper. Nickel is of high wear resistance and a nickel alloy improves the wear resistance of the film. Copper is of high corrosion resistance and a copper alloy improves the corrosion resistance of the film. The film may further contain self-lubricating particles and hard particles which ensure its wear resistance and lubricating property to a further extent. |
申请公布号 |
EP1461478(A2) |
申请公布日期 |
2004.09.29 |
申请号 |
EP20010271467 |
申请日期 |
2001.12.12 |
申请人 |
HONDA GIKEN KOGYO KABUSHIKI KAISHA |
发明人 |
ISHIGAMI, OSAMU;HIRATA, TOMOHIRO;OGAWA, YOSHIMITSU;YOSHIMOTO, NOBUHIKO |
分类号 |
C25D15/02;C25D5/10;C25D5/18;F02B77/02;(IPC1-7):C25D15/02 |
主分类号 |
C25D15/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|