发明名称 COMPOSITE PLATING FILM AND A PROCESS FOR FORMING THE SAME
摘要 A composite nickel and copper alloy plating film ( 3 ) containing nickel and copper. Nickel is of high wear resistance and a nickel alloy improves the wear resistance of the film. Copper is of high corrosion resistance and a copper alloy improves the corrosion resistance of the film. The film may further contain self-lubricating particles and hard particles which ensure its wear resistance and lubricating property to a further extent.
申请公布号 EP1461478(A2) 申请公布日期 2004.09.29
申请号 EP20010271467 申请日期 2001.12.12
申请人 HONDA GIKEN KOGYO KABUSHIKI KAISHA 发明人 ISHIGAMI, OSAMU;HIRATA, TOMOHIRO;OGAWA, YOSHIMITSU;YOSHIMOTO, NOBUHIKO
分类号 C25D15/02;C25D5/10;C25D5/18;F02B77/02;(IPC1-7):C25D15/02 主分类号 C25D15/02
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