发明名称 Method for patterning a multilayered conductor/substrate structure
摘要 <p>A method for patterning a multilayered conductor/substrate structure includes the steps of: providing a multilayered conductor/substrate structure which includes a plastic substrate and at least one conductive layer overlying the plastic substrate; and irradiating the multilayered conductor/substrate structure with ultraviolet radiation such that portions of the at least one conductive layer are ablated therefrom. In a preferred embodiment, a projection-type excimer laser system is employed to rapidly and precisely ablate a pattern from a mask into the at least one conductive layer. Preferably, the excimer laser is controlled in consideration of how well the at least one conductive layer absorbs radiation at particular wavelengths. Preferably, a fluence of the excimer laser is controlled in consideration of an ablation threshold level of at least one conductive layer. According to a preferred method, the excimer laser is employed and controlled to ablate portions of the at least one conductive layer without completely decomposing the at least one functional layer therebeneath.</p>
申请公布号 GB2389562(B) 申请公布日期 2004.09.29
申请号 GB20030019660 申请日期 2002.02.13
申请人 * AVERY DENNISON CORPORATION 发明人 KOUROCHE * KAIN;RAMIN * HEYDARPOUR
分类号 B23K26/36;G02F1/1333;G02F1/1343;H01L29/786;H01L51/52;H05K3/02;(IPC1-7):H01L21/302 主分类号 B23K26/36
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