发明名称 A method and apparatus for providing a substrate coating having a predetermined resistivity, and uses therefor
摘要 A method and apparatus for providing a substrate coating having a predetermined resistivity is described. The method comprises the steps of providing a substrate to be coated in a vacuum chamber, creating a plasma in the chamber, and depositing ions of the plasma on the substrate to form a ta-C substrate coating. The coating "step is stopped when the ta-C substrate coating has the predetermined resistivity. The predetermined resistivity is 10<SUP>5</SUP>-10<SUP>10 </SUP>Omegacm, and preferably about 10<SUP>6 </SUP>Omegacm. The substrate may be biased during the method to aid in arriving at the predetermined resistivity. The coating may be employed to reduce the risk of, or prevent electrostatic discharge to or from the substrate, or to provide a seed layer to improve adhesion between the substrate a further coating. Also described are coatings having predetermined resistivities.
申请公布号 GB0419177(D0) 申请公布日期 2004.09.29
申请号 GB20040019177 申请日期 2004.08.27
申请人 NANOFILM TECHNOLOGIES INTERNATIONAL PTE LTD 发明人
分类号 C23C14/06;H01L23/60;H01L51/52 主分类号 C23C14/06
代理机构 代理人
主权项
地址