SEMICONDUCTOR POWER DEVICE METAL STRUCTURE AND METHOD OF FORMATION

摘要

In accordance with one embodiment, a stress buffer ( 40 ) is formed between a power metal structure ( 90 ) and passivation layer ( 30 ). The stress buffer ( 40 ) reduces the effects of stress imparted upon the passivation layer ( 30 ) by the power metal structure ( 90 ). In accordance with an alternative embodiment, a power metal structure ( 130 A) is partitioned into segments ( 1091 ), whereby electrical continuity is maintained between the segments ( 1090 ) by remaining portions of a seed layer ( 1052 ) and adhesion/barrier layer ( 1050 ). The individual segments ( 1090 ) impart a lower peak stress than a comparably sized continuous power metal structure ( 9 ).