发明名称 |
Semiconductor device having contact electrode to semiconductor substrate |
摘要 |
An isolation region is embedded in a semiconductor substrate. The height of the upper face of the isolation region is substantially equal to the height of the surface of the semiconductor substrate. A gate electrode is formed on a gate insulating film and over the isolation region. A first side face of the gate electrode is formed over the isolation region. A second side face of the gate electrode is formed over the active region. A field insulator is formed on the isolation region. A first side face of the field insulator contacts with the first side face of the gate electrode. A second side face of the field insulator is continuous with a plane obtained by extending the side face of the isolation region. A sidewall insulator has a sidewall contacting with the second side face of the field insulator and the second side face of the gate electrode.
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申请公布号 |
US6797551(B2) |
申请公布日期 |
2004.09.28 |
申请号 |
US20020316765 |
申请日期 |
2002.12.11 |
申请人 |
KABUSHI KAISHA TOSHIBA |
发明人 |
OGUCHI KUMI |
分类号 |
H01L21/28;H01L21/336;H01L21/60;H01L21/76;H01L21/768;H01L21/8234;H01L27/08;H01L27/088;H01L29/78;(IPC1-7):H01L21/337 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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