发明名称 Semiconductor device having contact electrode to semiconductor substrate
摘要 An isolation region is embedded in a semiconductor substrate. The height of the upper face of the isolation region is substantially equal to the height of the surface of the semiconductor substrate. A gate electrode is formed on a gate insulating film and over the isolation region. A first side face of the gate electrode is formed over the isolation region. A second side face of the gate electrode is formed over the active region. A field insulator is formed on the isolation region. A first side face of the field insulator contacts with the first side face of the gate electrode. A second side face of the field insulator is continuous with a plane obtained by extending the side face of the isolation region. A sidewall insulator has a sidewall contacting with the second side face of the field insulator and the second side face of the gate electrode.
申请公布号 US6797551(B2) 申请公布日期 2004.09.28
申请号 US20020316765 申请日期 2002.12.11
申请人 KABUSHI KAISHA TOSHIBA 发明人 OGUCHI KUMI
分类号 H01L21/28;H01L21/336;H01L21/60;H01L21/76;H01L21/768;H01L21/8234;H01L27/08;H01L27/088;H01L29/78;(IPC1-7):H01L21/337 主分类号 H01L21/28
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