| 发明名称 |
Seed layer repair |
| 摘要 |
Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices. Also disclosed are electronic devices containing substantially continuous seed layers.
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| 申请公布号 |
US6797146(B2) |
申请公布日期 |
2004.09.28 |
| 申请号 |
US20010003151 |
申请日期 |
2001.11.02 |
| 申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
MORRISSEY DENIS;CALVERT JEFFREY M.;MIKKOLA ROBERT D. |
| 分类号 |
C25D3/38;C25D5/52;H01L21/288;H01L21/768;H05K3/24;(IPC1-7):C25D3/38;C25D5/02 |
主分类号 |
C25D3/38 |
| 代理机构 |
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代理人 |
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| 主权项 |
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