发明名称 Method of fabrication LCOS structure
摘要 A method is provided to fabricate a LCOS back plane structure. The present invention utilized a HV device such as HV CMOS transistor (high voltage complementary metal oxide semiconductor transistor) and a HV capacitor layer are applied to the substrate. Furthermore, the HV capacitor layer has a higher dielectric layer and coupling ratio to sustain the higher operating voltage, such that the operating capacitance can be raised. Moreover, the HV CMOS transistor is combined with a mirror layer which has a higher reflective property, such that the LCOS back-plate structure has the better contrast and chrominance output in per area unit, when the operating voltage range is increased.
申请公布号 US6797983(B2) 申请公布日期 2004.09.28
申请号 US20020060460 申请日期 2002.01.30
申请人 UNITED MICROELECTRONICS CORP. 发明人 CHEN RALPH;YANG MARCUS;TSAI YUAN-LI;HUANG CHING-CHUN;YANG SHENG-HSIUNG
分类号 G02F1/1362;(IPC1-7):H01L21/00;H01L29/04 主分类号 G02F1/1362
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