发明名称 Apparatus and method for monitoring plasma processing apparatus
摘要 The present apparatus comprises a vacuum process chamber 100 that contains an upper electrode 110 having a conductive plate 115 with gas supply holes for supplying a process gas and a lower electrode 130 having a platform on which a sample is to be mounted; process gas supply means 117 for supplying the process gas to the gas supply holes in the upper electrode 110 and exhaust means 106 for exhausting the vacuum process chamber; a high frequency power supply 121 for applying a high frequency power to the upper electrode to generate a plasma between the upper and lower electrodes; a high frequency bias power supply 122 for applying a high frequency power to the upper electrode to generate a direct current bias potential in the upper electrode; and abnormal discharge determination means 152 for determining whether an abnormal discharge has occurred or not based on the direct current bias potential generated in the upper electrode.
申请公布号 US6796269(B2) 申请公布日期 2004.09.28
申请号 US20020229027 申请日期 2002.08.28
申请人 HITCHI HIGH-TECHNOLOGIES CORPORATION 发明人 SASAKI ICHIRO;MASUDA TOSHIO;FURUSE MUNEO;YAMAMOTO HIDEYUKI
分类号 H01L21/3065;H01J37/32;H01L21/66;(IPC1-7):C23C16/509 主分类号 H01L21/3065
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