发明名称 Surface mount technology land grid array socket
摘要 An electrical socket is provided for receiving processors requiring only vertical mounting actuation. The socket includes a housing having an array of contacts, and a frame having a bottom surface and a contacting surface. The contacts have a loaded position and an unloaded position. The loaded position corresponds to the placement of a desired vertical load. The housing is slidably mounted to the frame. The contacting surface is located such that a processor abuts the contacting surface when the contacts are in the loaded position due to the placement of a processor and the bottom surface of the frame abuts a flat surface, such as a circuit board to which the socket is mounted.
申请公布号 US6796805(B2) 申请公布日期 2004.09.28
申请号 US20020212414 申请日期 2002.08.05
申请人 TYCO ELECTRONICS CORPORATION 发明人 MURR KEITH MCQUILKEN
分类号 H01R12/16;H01R13/24;(IPC1-7):H01R12/00 主分类号 H01R12/16
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