发明名称 |
Surface mount technology land grid array socket |
摘要 |
An electrical socket is provided for receiving processors requiring only vertical mounting actuation. The socket includes a housing having an array of contacts, and a frame having a bottom surface and a contacting surface. The contacts have a loaded position and an unloaded position. The loaded position corresponds to the placement of a desired vertical load. The housing is slidably mounted to the frame. The contacting surface is located such that a processor abuts the contacting surface when the contacts are in the loaded position due to the placement of a processor and the bottom surface of the frame abuts a flat surface, such as a circuit board to which the socket is mounted.
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申请公布号 |
US6796805(B2) |
申请公布日期 |
2004.09.28 |
申请号 |
US20020212414 |
申请日期 |
2002.08.05 |
申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
MURR KEITH MCQUILKEN |
分类号 |
H01R12/16;H01R13/24;(IPC1-7):H01R12/00 |
主分类号 |
H01R12/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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