发明名称 |
Semiconductor module having an upper layer semiconductor package overlying a lower layer semiconductor package |
摘要 |
A semiconductor module includes a substrate having a pad electrode on a surface, a lower layer semiconductor package mounted on the substrate, and an upper layer semiconductor package mounted on the substrate while arranged in a position substantially overlying the former. The pad electrodes connected to the leads of these semiconductor packages are arranged alternately. The lead has a dambar residual portion. An inner surface of a lead downward portion of the upper layer semiconductor package is positioned outside an outer surface of a lead downward portion of the lower layer semiconductor package.
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申请公布号 |
US6798056(B2) |
申请公布日期 |
2004.09.28 |
申请号 |
US20020231148 |
申请日期 |
2002.08.30 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
MATSUURA TETSUYA;KASATANI YASUSHI;MICHII KAZUNARI |
分类号 |
H01L25/18;H01L25/10;H01L25/11;H05K1/18;H05K7/02;(IPC1-7):H01L23/02;H01L23/34 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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