Method for mounting electronic part and paste material

摘要

In a method for mounting an electronic part on a mounting substrate in that projection electrodes provided on the electronic part are welded by fusion to join connection terminals provided on the mounting substrate, the flux paste includes a base flux and metal grains having diameters smaller than the diameters of projection electrodes and having a thickness so as to form a space between the flux paste and the electronic part when the electronic part is mounted on the mounting substrate and the flux paste is arranged on the mounting substrate. A resin is sealed in the space formed between the electronic part and the mounting substrate after the projection electrodes are joined to the connection terminals.