发明名称 |
Protecting resin-encapsulated components |
摘要 |
A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin. |
申请公布号 |
US6798645(B2) |
申请公布日期 |
2004.09.28 |
申请号 |
US20040759311 |
申请日期 |
2004.01.16 |
申请人 |
KEMET ELECTRONICS CORP. |
发明人 |
MELODY BRIAN JOHN;KINARD JOHN TONY;PERSICO DANIEL F.;STOLARSKI CHRIS;LESSNER PHILLIP MICHAEL;CHEN QINGPING;PRITCHARD KIM;HARRINGTON ALBERT KENNEDY;WHEELER DAVID ALEXANDER |
分类号 |
H01G9/00;H01G9/012;H01L23/495;(IPC1-7):H01G4/228;H01G5/03;H01G9/10 |
主分类号 |
H01G9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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