| 摘要 |
PROBLEM TO BE SOLVED: To provide a temperature control unit for a wiring board capable of preventing the occurrence of faulty installation of parts such as a semiconductor chip on a wiring board, and to provide a reflow system equipped with the same. SOLUTION: The temperature control unit 23 has a cylindrical blast pipe 30 and a disk-shape blast head 31 joined to the lower end of the blast pipe 30. The blast head 31 has an inner section 40 communicating with the inner section 33 of the blast pipe 30 and a lower surface 41 constituted of a punching metal having a multiplicity of through holes 42 running in the vertical direction. The blast pipe 30 guides downward the gas with its temperature adjusted in the inner section 33. The blast head 31 blasts the gas, guided from the inner section 33 of the blast pipe 30 to the inner section 40, via the through holes 42 onto the in-transit wiring board. The blast pipe 30 and the blast head 31 are rotated by a driving force transmitted to a toothed gear 34 formed on the peripheral surface of the blast pipe 30 in its circumferential direction. COPYRIGHT: (C)2004,JPO&NCIPI
|
