| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating device that can be improved in foot print and is excellent in expandability. SOLUTION: This substrate treating device 1 can be improved in foot print, because wafers W are transferred among a load-lock chamber 8, a CVD 13, and an etching section 14 by means of a stage 18a which can move linearly, and a single-shaft articulated robot 19 which is a transporting means without accompanying any revolving motion. In addition, this substrate treating device 1 is excellent in expandability, because, when the number of treating chambers of the CVD 13, etching section 14, etc., increases, the increased number can be coped with by only extending a conveyance path 12 linearly. COPYRIGHT: (C)2004,JPO&NCIPI
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