| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for inspecting a semiconductor wafer which can grasp a manufacturing process and which can shorten an inspecting time while the quality of inspecting the semiconductor wafer is maintained. SOLUTION: The method for inspecting the semiconductor wafer includes the steps of dividing the semiconductor wafer into n pieces of regions, setting arbitrarily m pieces of the regions from the n pieces (n>m) of the regions indispensably and selectively inspecting the arbitrarily m pieces of the regions, and judging good or bad based on the inspected result (S1). The method further includes the steps of then performing the indispensable inspection for (n-m) pieces of the regions, performing the selective inspection in response to the accumulated defective rate of the selective inspection, and judging the good or not based on the inspected result (S4-S8). COPYRIGHT: (C)2004,JPO&NCIPI
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