| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting components by which the mounting components can be mounted at high density even if an uneven part is formed on an object to be mounted. SOLUTION: A through hole 3 of a holding body 2 is filled with a solder paste 6 in a filling step s2 and an electronic component 7 is held by the holding body 2 in a holding step s3. Then the holding body is aligned with a substrate 12 in a mounting step s4, and the electronic component 7 is adhered to the substrate 12 by the solder paste 6 in an adhering step s5. The holding body 2 is aligned and the electronic component 7 is arranged at the mounting position, and then the electronic component 7 is adhered to the substrate 12 by the solder paste 6 applied to the through hole 3. Thus, it becomes unnecessary to position an adhering position where the solder paste 6 is adhered to the substrate 12, and the electronic component can be easily adhered to the substrate 12 even if an uneven part is formed on an object 9 to be mounted. COPYRIGHT: (C)2004,JPO&NCIPI
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