发明名称 METHOD FOR MANUFACTURING CERAMIC ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic electronic part, which has a step of heat treatment for effectively recovering the characteristics deteriorated by laser trimming. SOLUTION: A ceramic electronic part, such as a single plate capacitor 1, is provided, which comprises a part body consisting of an oxide ceramic obtained through steps of forming and baking a conductive film 3 comprising base metal. A laser beam is irradiated on the ceramic electronic part to partially remove the conductive film 3 for forming a trimmed part 5. In giving heat treatment thereafter to the resultant, heat treatment temperature is set to be 50% or more of the baking temperature [°C] in the baking step and to be less than the baking temperature, and heat treatment atmosphere is set to be log (redox average oxygen partial pressure [MPa] of metal base at the heat treatment) -8 or more and to be log (redox average oxygen partial pressure [MPa] of metal base at the heat treatment) +5 or below. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004266113(A) 申请公布日期 2004.09.24
申请号 JP20030055360 申请日期 2003.03.03
申请人 MURATA MFG CO LTD 发明人 NAITO MASAHIRO;SAKASHITA HIDEYASU
分类号 H01G4/12;H01F27/00;H01G4/255;H01G4/40;H01G13/06;H03H7/09;(IPC1-7):H01G4/255 主分类号 H01G4/12
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