| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a protective film at high precision on the surface of a substrate having an opening formed in it. SOLUTION: The substrate is processed by a process including a step of forming a protective film on the substrate, a step of etching the surface of the protective film, a step of forming an etch-resist film on the etched protective film, a step of forming an opening pattern on the protective film and the etch-resist film, a step of forming an opening in the substrate by etching the substrate via the opening pattern, a step of removing an edge portion of the protective film which has been generated upon the formation of the opening and is protruding toward the opening, and a step of removing the etch-resist film. COPYRIGHT: (C)2004,JPO&NCIPI
|
