发明名称 ETCHING METHOD AND ETCHING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide an etching method which can properly determine the end point in etching a substrate and to provide an etching system. SOLUTION: When etching a substrate 100 is started, the micropattern part 100a of the substrate 100 is irradiated with light from a light source 2. A light detector 5 receives diffracted light and produces a detection signal in response to its condensedness. The information processing part 94a of a control unit 94 performs an image processing based on the detection signal to obtain a pattern of the diffracted light from the micropattern part 100a. The arithmetic part 94b of the control unit 94 compares the pattern shape of the diffracted light from the micropattern part 100a with the pattern shape of a diffracted light in the optimal etching state prestored in the memory unit 91 and judges their agreement or disagreement. When they agree with each other, the time when the judgement is performed is adopted as the end point of the etching. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004263283(A) 申请公布日期 2004.09.24
申请号 JP20030057413 申请日期 2003.03.04
申请人 KONICA MINOLTA HOLDINGS INC 发明人 MITSUKI NAOKI;FURUTA KAZUMI;MIYAKOSHI HIROSHI
分类号 G01B11/24;C23F4/00;G02B5/18;(IPC1-7):C23F4/00 主分类号 G01B11/24
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