| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to buffer impact on an object, such as, for example, semiconductor wafer, in a package, so that a desired amount of cushion is provided in transportation and carriage. SOLUTION: A buffering material for packaging refers to a plastic cushion pad 40 including at least one plastic spring portion 46 between oppositely facing contact surfaces 42, 44. The pad 40 is vacuum- formed using a film of carbon-impregnated polystyrene material. The plastic spring portion 46 is configured to provide a desired amount of resiliency or cushion provided by the pad responsive to a compressive force, and is designed to prevent any lateral deformation of the pad when a compressive force is applied. COPYRIGHT: (C)2004,JPO&NCIPI |
