PACKAGE FOR SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING IT

摘要

PROBLEM TO BE SOLVED: To solve the problem that a working mass productivity and a working dimensional accuracy are deteriorated because a specified shape is cut and worked from the block of a metal such as cobalt and a metallic frame with a through-hole is formed by cutting-out and working a hollow square pipe in the specified shape. SOLUTION: The metallic frame is formed by joining a plurality of metallic molded forms having a symmetric shape, a metallic base and the metallic frame are joined with a metallic solder material, the through-holes are formed to the metallic frame and lead terminals are bonded with an insulator in the through-holes. COPYRIGHT: (C)2004,JPO&NCIPI