HEAT SINK, SUBSTRATE FOR POWER MODULES USING THE HEAT SINK, POWER MODULE AND PROCESS FOR PRODUCING HEAT SINK

摘要

PROBLEM TO BE SOLVED: To provide a heat sink in which warp can be reduced regardless of difference in the thermal expansion coefficient between an insulating substrate and the heat sink and lowering of thermal conductivity can be suppressed, and to provide a substrate for power module employing that heat sink and a process for producing the heat sink. SOLUTION: The heat sink 16 for dissipating heat of a heat dissipated body comprises a heat sink body 17, and a low thermal expansion material 18 having a thermal expansion coefficient lower than that of the heat sink body 17. The heat sink body 17 is a multilayered body at least of a plate-like body 17a and a casting 17b wherein the plate-like body 17a is arranged on each outermost layer of the heat sink body 17 and the low thermal expansion material 18 composed of an aggregate of Si particles is cast by the casting 17b between the plate-like bodies 17a through the gap of the Si particles. COPYRIGHT: (C)2004,JPO&NCIPI